HP DL360 G7 Intel Xeon E5649 (2.53GHz/6-core/12MB/80W) Processor Kit

HP DL360 G7 Intel Xeon E5649 (2.53GHz/6-core/12MB/80W) Processor Kit

The HP DL360 G7 Intel Xeon E5649 Processor Kit represents Hewlett Packard Enterprise’s processor upgrade solution for the ProLiant DL360 Generation 7 1U rackmount server platform, delivering enterprise-class hexa-core processing performance with Intel’s Xeon E5649 processor operating at 2.53GHz base frequency with Turbo Boost capability up to 2.93GHz, six physical cores with Hyper-Threading technology supporting twelve simultaneous execution threads, 12MB shared L3 cache for efficient data access, 80-watt thermal design power optimized for 1U rackmount density and airflow characteristics, 5.86 GT/s QuickPath Interconnect bandwidth, DDR3-1333 memory controller support, 32nm process technology, comprehensive Intel virtualization technologies, and specialized heatsink assembly engineered for high-velocity front-to-back airflow in dense rack environments, providing IT administrators with the essential processor upgrade path for enhancing computational capacity in virtualized environments, database workloads, web hosting, enterprise applications, and multi-threaded business applications within space-constrained data center rack infrastructure requiring reliable, scalable, and energy-efficient 1U server processing.

This processor kit provides the critical performance upgrade component for HP ProLiant DL360 G7 rackmount servers in enterprise data centers.

Key Features

• Intel Xeon E5649 processor
• 6 cores / 12 threads
• 2.53GHz base frequency
• Up to 2.93GHz Turbo Boost
• 12MB L3 cache
• 80W TDP
• LGA1366 socket
• 5.86 GT/s QPI
• DDR3-1333 support
• 1U rackmount optimized
• Hyper-Threading Technology
• Intel Turbo Boost
• Virtualization technologies
• 32nm process

Intel Xeon E5649 Architecture

Processor Specifications:

• Model: Intel Xeon E5649
• Code Name: Westmere-EP
• Manufacturing: 32nm process
• Base Frequency: 2.53GHz
• Turbo Frequency: 2.93GHz
• Physical Cores: 6
• Logical Threads: 12
• TDP: 80W
• Socket: FCLGA1366
• Product Family: Xeon 5600 series
• Launch: Q1 2011

Westmere-EP Architecture:

• Enhanced Nehalem microarchitecture
• 32nm die shrink
• Improved power efficiency
• Advanced power management
• Enhanced virtualization
• Proven enterprise reliability

Six-Core Multi-Threading

Hexa-Core Performance:

• 6 independent processor cores
• Parallel execution capability
• Multi-application processing
• Workload distribution
• Virtual machine hosting
• Database transaction processing
• Concurrent user support
• Enterprise application performance

12-Thread Capability:

• Intel Hyper-Threading
• 2 threads per core
• 12 logical processors
• Improved utilization
• Enhanced throughput
• Better VM density
• Responsive multitasking

Performance Scaling:

• Linear scaling for parallel workloads
• Excellent multi-VM performance
• Database query optimization
• Web server scalability
• Application server capacity
• Batch processing efficiency

Turbo Boost Technology

Dynamic Frequency Scaling:

• Base: 2.53GHz all-core
• Turbo: Up to 2.93GHz
• 400MHz boost potential
• Automatic performance
• Thermal-aware
• Power-aware
• Workload-adaptive

Turbo Activation:

• Single-threaded boost
• Light workload optimization
• Opportunistic performance
• Transparent operation
• No manual intervention
• Operating system agnostic

12MB Shared L3 Cache

Large Cache Benefits:

• 12MB Level 3 cache
• All cores share access
• Reduced memory latency
• Improved hit rates
• Database performance
• Application responsiveness
• Efficient data sharing

Cache Architecture:

• Smart cache technology
• Dynamic allocation
• Core-to-core communication
• Reduced bandwidth demand
• Lower power consumption
• Performance consistency

80W TDP – 1U Optimized

Thermal Design:

• 80-watt TDP
• 1U server optimized
• Dense deployment capable
• Efficient cooling utilization
• Front-to-back airflow
• High-velocity fans
• Rack density enablement

Power Efficiency:

• Balanced performance/watt
• Data center power savings
• Reduced cooling costs
• Enhanced power density
• Green computing
• Total cost of ownership reduction

HP ProLiant DL360 G7 Platform

Target Server:

• ProLiant DL360 Generation 7
• 1U rackmount form factor
• Dual-socket capable
• 12 DIMM slots per processor
• 8x 2.5″ SFF drive bays (maximum)
• Redundant hot-plug components
• Industry-leading 1U density

Server Features:

• FlexibleLOM networking
• Smart Array RAID controllers
• Redundant power supplies
• Hot-plug fans
• Integrated Lights-Out (iLO 3)
• Embedded diagnostics
• Tool-less design

1U Rackmount Advantages

Space Efficiency:

• Single rack unit height
• 42 servers per 42U rack
• Maximum rack density
• Data center space optimization
• Cost-effective footprint
• High compute per U

DL360 G7 Design:

• 26.4″ depth
• Tool-less access
• Cable management arms
• Hot-plug components
• Front-accessible drives
• Optimized airflow

QuickPath Interconnect

5.86 GT/s QPI:

• High-speed interconnect
• Dual-processor communication
• 23.4 GB/s bandwidth (bidirectional)
• Low latency
• Coherent memory access
• NUMA support
• Scalable multi-socket

Multi-Processor Benefits:

• Two E5649 processors = 12 cores/24 threads
• 24MB total L3 cache
• 384GB maximum memory
• Enhanced throughput
• Linear performance scaling
• Enterprise workload capacity

DDR3-1333 Memory Support

Memory Specifications:

• DDR3-1333 (PC3-10600)
• Triple-channel architecture
• 3 channels per processor
• 21.3 GB/s per socket
• Up to 192GB per processor
• 384GB maximum (dual-socket)
• ECC memory support

Memory Configuration:

• 12 DIMM slots per CPU
• 24 slots total (dual-socket)
• RDIMM support
• LRDIMM support
• Memory interleaving
• Advanced ECC
• Online spare memory

Virtualization Technologies

Intel VT-x:

• Hardware virtualization
• VMware certified
• Hyper-V compatible
• XenServer support
• KVM ready
• Enhanced VM performance
• Reduced overhead

Intel VT-d:

• I/O virtualization
• Direct device assignment
• SR-IOV support
• Enhanced I/O performance
• Virtual function support
• Improved security

Virtualization Benefits:

• Higher VM density
• Better consolidation ratios
• Improved performance
• Enhanced security
• Flexible resource allocation
• Production-ready platform

Processor Kit Components

What’s Included:

• Intel Xeon E5649 processor
• 1U rackmount heatsink
• Thermal interface material
• Installation instructions
• HPE certification
• Part identification labels

1U Heatsink Design:

• Optimized fin density
• High-velocity airflow
• Copper base
• Aluminum fins
• Precise mounting
• Thermal efficiency

Installation Considerations

Technical Requirements:

• Qualified technician recommended
• ESD protection essential
• Thermal paste application
• Proper torque specifications
• BIOS/firmware updates
• System ROM compatibility
• iLO firmware current

Installation Steps:

1. Power down and unplug
2. Remove server cover
3. Remove existing processor/heatsink
4. Install new processor in socket
5. Apply thermal interface
6. Mount heatsink assembly
7. Secure properly
8. Replace cover
9. Update firmware
10. Test system

Ideal Workloads

Virtualization:

• VMware vSphere hosts
• Microsoft Hyper-V servers
• Citrix XenServer
• VDI infrastructure
• Virtual appliances
• Container hosting
• Development/test labs

Database Servers:

• SQL Server
• Oracle Database
• MySQL/MariaDB
• PostgreSQL
• NoSQL databases
• OLTP systems
• Data marts

Web Hosting:

• Web servers (IIS, Apache, nginx)
• Application servers
• PHP/Python/Ruby environments
• E-commerce platforms
• Content management systems
• Load balancing nodes

Enterprise Applications:

• Email servers (Exchange, Notes)
• Collaboration platforms
• ERP systems
• CRM applications
• File/print services
• Domain controllers
• Authentication servers

Cloud Infrastructure:

• OpenStack compute nodes
• Kubernetes clusters
• Private cloud platforms
• Hybrid cloud gateways
• Orchestration servers
• Management nodes

Performance Positioning

Xeon 5600 Series:

• Entry: E5606 (4-core, 2.13GHz)
• Mainstream: E5649 (6-core, 2.53GHz) ← This processor
• Performance: X5680 (6-core, 3.33GHz)
• Sweet spot for most workloads
• Excellent price/performance
• Proven reliability

Dual-Processor Configuration

Dual E5649 System:

• 12 physical cores total
• 24 logical threads
• 24MB combined L3 cache
• 384GB maximum memory
• Balanced performance
• Cost-effective scaling
• Enterprise-ready capacity

NUMA Considerations:

• Two NUMA nodes
• Memory locality
• Process affinity
• Optimized scheduling
• Application awareness
• Performance tuning

System Management

HP Integrated Lights-Out 3 (iLO 3):

• Remote management
• Virtual media
• Remote console
• Power management
• Health monitoring
• Firmware updates
• Out-of-band access

Monitoring & Diagnostics:

• Temperature monitoring
• Fan speed control
• Power consumption tracking
• Event logging
• Predictive failure alerts
• System diagnostics

Power & Cooling

Thermal Management:

• 80W per processor
• 160W dual-processor thermal load
• Redundant hot-plug fans
• Variable speed control
• Temperature sensors
• Thermal throttling protection

Power Supply:

• Redundant hot-plug PSUs
• 460W to 750W options
• 80 PLUS certified
• Power budgeting
• Load balancing
• Efficiency optimization

Firmware & Compatibility

System Requirements:

• System ROM 2012.01.12 or later
• iLO 3 firmware 1.26 or later
• Compatible with all DL360 G7 revisions
• Driver support in all major OS
• Validated configurations
• HPE compatibility matrix

Memory Optimization

Best Practices:

• Populate all channels evenly
• Use matched DIMM sets
• DDR3-1333 for full speed
• RDIMM for density
• Advanced ECC enabled
• Monitor correctable errors

Part Numbers

HP Part Numbers:

• 587491-B21: Processor Kit
• 587491-L21: International version
• 592272-001: Spare part number
• Various FRU numbers
• Region-specific variants

Operating System Support

Certified Operating Systems:

• Windows Server 2008/2008 R2/2012
• Red Hat Enterprise Linux
• SUSE Linux Enterprise Server
• VMware ESXi
• Citrix XenServer
• Ubuntu Server
• Debian

Why Choose E5649 for DL360 G7

1. Proven 1U rackmount performance
2. 6 cores / 12 threads
3. Balanced 80W TDP
4. Turbo Boost capability
5. Large 12MB cache
6. Excellent virtualization
7. HPE validated configuration
8. Cost-effective upgrade
9. Wide software support
10. Mature, stable platform

Upgrade Path Benefits

From Lower Processors:

• Upgrade from E5606 (4-core)
• Upgrade from E5620 (4-core)
• Significant core count increase
• Enhanced multi-threaded performance
• Better VM density
• Improved application performance

Warranty & Support

HPE Support:

• Standard HPE warranty
• Global support network
• Online resources
• Firmware downloads
• Driver updates
• Technical documentation
• Service parts available

Enterprise 1U processor upgrade for HP ProLiant DL360 G7 – the Intel Xeon E5649 Processor Kit delivers hexa-core rackmount performance with 2.53GHz base frequency (up to 2.93GHz Turbo Boost), Hyper-Threading supporting 12 simultaneous threads, 12MB shared L3 cache, 80W TDP optimized for 1U density, 5.86 GT/s QuickPath Interconnect, DDR3-1333 memory controller supporting up to 192GB per socket, comprehensive Intel virtualization technologies (VT-x, VT-d), and specialized 1U heatsink assembly engineered for high-velocity airflow, providing IT administrators with reliable, scalable enterprise rackmount server performance for virtualization platforms, database hosting, web servers, enterprise applications, and data center consolidation within space-constrained rack environments requiring proven processor technology for mission-critical operations!